THERMOSET OMT
A THERMOSET module monitors the surface temperature of a material by means of an infrared radiation pyrometer.
On many nonwoven bonding processes, the temperature attained by the product is of vital importance.
When the product is bonded by liquefied agents, the latter have to be cured by subjecting them to heat (dried, cured or polimerised in accordance with the applied agent). Bonding by solids in the form of fibre or powder likewise requires the application of heat (hot-melt).
In isolated instances, checking the once only attainment of a target temperature suffices as a process-control variable.
The pyrometer can be supplied with a cooling fan for mounting externally, or in compact form HP-250A for use inside the dryer.
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Infrared radiation pyrometer HP-250A
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